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d a t a sh eet product specification 2002 may 22 integrated circuits uda1334bt low power audio dac
2002 may 22 2 nxp semiconductors product specification low power audio dac uda1334bt contents 1 features 1.1 general 1.2 multiple format data interface 1.3 dac digital sound processing 1.4 advanced audio configuration 2 applications 3 general description 4 ordering information 5 quick reference data 6 block diagram 7 pinning 8 functional description 8.1 system clock 8.2 interpolation filter 8.3 noise shaper 8.4 filter stream dac 8.5 power-on reset 8.6 feature settings 8.6.1 digital interface format select 8.6.2 mute control 8.6.3 de-emphasis control 8.6.4 power control and sampling frequency select 9 limiting values 10 handling 11 thermal characteristics 12 quality specification 13 dc characteristics 14 ac characteristics 14.1 2.0 v supply voltage 14.2 3.0 v supply voltage 14.3 timing 15 application information 16 package outline 17 soldering 17.1 introduction to soldering surface mount packages 17.2 reflow soldering 17.3 wave soldering 17.4 manual soldering 17.5 suitability of surface mount ic pa ckages for wave and reflow soldering methods 18 data sheet status 19 disclaimers
2002 may 22 3 nxp semico nductors product specification low power audio dac uda1334bt 1 features 1.1 general ? 1.8 to 3.6 v power supply voltage ? integrated digital filter plus dac ? supports sample frequencies from 8 to 100 khz ? automatic system clock versus sample rate detection ? low power consumption ? no analog post filtering required for dac ? slave mode only applications ? easy application ? so16 package. 1.2 multiple format data interface ? i 2 s-bus and lsb-justified format compatible ? 1f s input data rate. 1.3 dac digital sound processing ? digital de-emphasis for 44.1 khz sampling rate ? mute function. 1.4 advanced audio configuration ? high linearity, wide dynamic range and low distortion ? standby or sleep mode in which the dac is powered down. 2 applications this audio dac is excellentl y suitable for digital audio portable application, such as portable md, mp3 and dvd players. 3 general description the uda1334bt supports the i 2 s-bus data format with word lengths of up to 24 bits and the lsb-justified serial data format with word lengths of 16, 20 and 24 bits. the uda1334bt has basic features such as de-emphasis (at 44.1 khz sampling rate) and mute. 4 ordering information type number package name description version uda1334bt so16 plastic small outline package; 16 leads; body width 3.9 mm sot109-1
2002 may 22 4 nxp semico nductors product specification low power audio dac uda1334bt 5 quick reference data note 1. the dac output voltage scales proportionally to the power supply voltage. symbol parameter conditions min. typ. max. unit supplies v dda dac analog supply voltage 1.8 2.0 3.6 v v ddd digital supply voltage 1.8 2.0 3.6 v i dda dac analog supply current normal operating mode ? 2.3 ? ma sleep mode ? 125 ? a i ddd digital supply current normal operating mode ? 1.4 ? ma sleep mode clock running ? 250 ? a no clock running ? 20 ? a t amb ambient temperature ? 40 ? +85 c digital-to-analog converter (v dda =v ddd =2.0v) v o(rms) output voltage (rms value) at 0 db (fs) digital input; note 1 ? 600 ? mv (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s =44.1khz; at 0db ?? 80 ? db f s =44.1khz; at ? 60 db; a-weighted ?? 37 ? db f s =96khz; at 0db ?? 75 ? db f s =96khz; at ? 60 db; a-weighted ?? 35 ? db s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted ? 97 ? db f s = 96 khz; code = 0; a-weighted ? 95 ? db cs channel separation ? 100 ? db digital-to-analog converter (v dda =v ddd =3.0v) v o(rms) output voltage (rms value) at 0 db (fs) digital input; note 1 ? 900 ? mv (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s =44.1khz; at 0db ?? 90 ? db f s =44.1khz; at ? 60 db; a-weighted ?? 40 ? db f s =96khz; at 0db ?? 85 ? db f s =96khz; at ? 60 db; a-weighted ?? 37 ? db s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted ? 100 ? db f s = 96 khz; code = 0; a-weighted ? 98 ? db cs channel separation ? 100 ? db power dissipation (at f s =44.1khz) p power dissipation playback mode at 2.0 v supply voltage ? 7.4 ? mw at 3.0 v supply voltage ? 17 ? mw sleep mode; at 2.0 v supply voltage clock running ? 0.75 ? mw no clock running ? 0.3 ? mw
2002 may 22 5 nxp semico nductors product specification low power audio dac uda1334bt 6 block diagram handbook, full pagewidth mgu676 dac uda1334bt noise shaper interpolation filter de-emphasis 14 15 dac 6 digital interface 16 3 2 1 4 5 11 7 13 12 voutr bck v ssa ws voutl datai v dda v ddd v ref(dac) v ssd sfor0 sysclk 8 mute 9 deem 10 pcs sfor1 fig.1 block diagram.
2002 may 22 6 nxp semico nductors product specification low power audio dac uda1334bt 7 pinning notes 1. 5 v tolerant is only supported if the power supply volt age is between 2.7 and 3.6 v. for lower power supply voltages this is maximum 3.3 v tolerant. 2. because of test issues these pads are not 5 v tolerant and they should be at power supply voltage level or at a maximum of 0.5 v above that level. symbol pin pad type description bck 1 5 v tolerant digital inpu t pad; note 1 bit clock input ws 2 5 v tolerant digital input pad; note 1 word select input datai 3 5 v tolerant digital inpu t pad; note 1 serial data input v ddd 4 digital supply pad digital supply voltage v ssd 5 digital ground pad digital ground sysclk 6 5 v tolerant digital input pad; note 1 system clock input sfor1 7 5 v tolerant digital input pad; note 1 serial format select 1 mute 8 5 v tolerant digital input pad; note 1 mute control deem 9 5 v tolerant digital input pad; note 1 de-emphasis control pcs 10 3-level input pad; note 2 power control and sampling frequency select sfor0 11 digital input pad; note 2 serial format select 0 v ref(dac) 12 analog pad dac reference voltage v dda 13 analog supply pad dac analog supply voltage voutl 14 analog output pad dac output left v ssa 15 analog ground pad dac analog ground voutr 16 analog output pad dac output right handbook, halfpage mgu675 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 voutr bck v ssa ws voutl datai v dda v ddd v ref(dac) v ssd sfor0 sysclk pcs sfor1 deem mute uda1334bt fig.2 pin configuration.
2002 may 22 7 nxp semico nductors product specification low power audio dac uda1334bt 8 functional description 8.1 system clock the uda1334bt operates in slave mode only; this means that in all applications the system must provide the system clock and the digital audio interface signals (bck and ws). the system clock must be locked in frequency to the digital interface signals. the uda1334bt automatically detects the ratio between the sysclk and ws frequencies. the bck clock can be up to 64f s , or in other words the bck frequency is 64 times the word select (ws) frequency or less: f bck 64 f ws . remarks: 1. the ws edge must fall on the negative edge of the bck at all times for proper operation of the digital i/o data interface 2. for lsb-justified fo rmats it is important to have a ws signal with a duty factor of 50%. the modes which are supported are given in table 1. table 1 supported sampling ranges notes 1. this mode can only be supported for power supply voltages down to 2.4 v. for lower voltages, in 192f s mode the sampling frequency should be limited to 55 khz. 2. not supported in the low sampling frequency mode. an example is given in table 2 for a 12.228 mhz system clock input. table 2 example using a 12.228 mhz system clock note 1. this mode can only be supported for power supply voltages down to 2.4 v. for lower voltages, in 192f s mode the sampling frequency should be limited to 55 khz. 8.2 interpolation filter the interpolation digital filter interpolates from 1f s to 64f s by cascading fir filters (see table 3). table 3 interpolation filter characteristics 8.3 noise shaper the 5th-order noise shaper operates at 64f s . it shifts in-band quantization noise to frequencies well above the audio band. this noise shaping technique enables high signal-to-noise ratios to be achieved. the noise shaper output is converted into an analog signal using a filter stream dac (fsdac). clock mode sampling range 768f s 8to55khz 512f s 8to100khz 384f s 8to100khz 256f s 8to100khz 192f s 8 to 100 khz (1)(2) 128f s 8to100khz (2) clock mode sampling frequency 128f s 96 khz 192f s 64 khz (1) 256f s 48 khz 384f s 32 khz 512f s 24 khz 768f s 16 khz item condition value (db) pass-band ripple 0 to 0.45f s 0.02 stop band >0.55f s ? 50 dynamic range 0 to 0.45f s >114
2002 may 22 8 nxp semico nductors product specification low power audio dac uda1334bt 8.4 filter stream dac the fsdac is a semi-digital reconstruction filter that converts the 1-bit data stream of the noise shaper to an analog output voltage. the filter coefficients are implemented as current sources and are summed at virtual ground of the output operational amplifier. in this way very high signal-to-noise performance and low clock jitter sensitivity is achiev ed. no post-filter is needed due to the inherent filter function of the dac. on-board amplifiers convert the fsdac output curr ent to an output voltage signal capable of driving a line output. the output voltage of the fsdac scales proportionally with the power supply voltage. 8.5 power-on reset the uda1334bt has an internal power-on reset circuit (see fig.3) which resets the test control block. the reset time (see fig.4) is determined by an external capacitor which is connected between pin v ref(dac) and ground. the reset time should be at least 1 s for v ref(dac) < 1.25 v. when v dda is switched off, the device will be reset again for v ref(dac) <0.75 v. during the reset time the system clock should be running. handbook, halfpage v dda v ref(dac) 3.0 v 13 12 mgu678 uda1334bt c1 > 10 f reset circuit 50 k 50 k fig.3 power-on reset circuit. handbook, halfpage 3.0 v ddd (v) 1.5 0 t 3.0 v dda (v) 1.5 0 t 3.0 v ref(dac) (v) 1.5 1.25 0.75 0 t mgl984 > 1 s fig.4 power-on reset timing.
2002 may 22 9 nxp semico nductors product specification low power audio dac uda1334bt 8.6 feature settings the features of the uda1334bt can be set by control pins sfor1, sfor0, mute, deem and pcs. 8.6.1 d igital interface format select the digital audio interface formats (see fig.5) can be selected via the pins sfor1 and sfor0 as shown in table 4. table 4 data format selection 8.6.2 m ute control the output signal can be soft muted by setting pin mute to high level as shown in table 5. table 5 mute control 8.6.3 d e - emphasis control de-emphasis can be switched on for f s = 44.1 khz by setting pin deem at high level. the function description of pin deem is given in table 6. table 6 de-emphasis control remark: the de-emphasis function in only supported in the normal operating mode, not in the low sampling frequency mode. 8.6.4 p ower control and sampling frequency select pin pcs is a 3-level pin and is used to set the mode of the uda1334bt. the definition is given in table 7. table 7 pcs function definition the low sampling frequency mode is required to have a higher oversampling rate in the noise shaper in order to improve the signal-to-noise ratio. in this mode the oversampling ratio of the noise shaper will be 128f s instead of 64f s . sfor1 sfor0 input format low low i 2 s-bus input low high lsb-justified 16 bits input high low lsb-justified 20 bits input high high lsb-justified 24 bits input mute function low mute off high mute on deem function low de-emphasis off high de-emphasis on pcs function low normal operating mode mid low sampling frequency mode high power-down or sleep mode
2002 may 22 10 nxp semiconductors product specification low power audio dac uda1334bt handbook, full pagewidth mgs75 2 16 b5 b6 b7 b8 b9 b10 left lsb-justified format 24 bits w s b ck d ata right 15 18 17 20 19 22 21 23 24 21 b3 b4 msb b2 b23 lsb 16 b5 b6 b7 b8 b9 b10 15 18 17 20 19 22 21 23 24 21 b3 b4 msb b2 b23 lsb 16 msb b2 b3 b4 b5 b6 left lsb-justified format 20 bits w s b ck d ata right 15 18 17 20 19 2 1 b19 lsb 16 msb b2 b3 b4 b5 b6 15 18 17 20 19 2 1 b19 lsb 16 msb b2 left lsb-justified format 16 bits w s b ck d ata right 15 2 1 b15 lsb 16 msb b2 15 2 1 b15 lsb msb msb b2 2 1 > = 8 12 3 left i 2 s-bus format ws bck d ata right 3 > = 8 msb b2 fig.5 digital audio formats
2002 may 22 11 nxp semico nductors product specification low power audio dac uda1334bt 9 limiting values in accordance with the absolute maximum rating system (iec 60134). note 1. all supply connections must be made to the same power supply. 2. short-circuit test at t amb =0 c and v dda = 3 v. dac operation after short-circuiting cannot be warranted. 10 handling inputs and outputs are protected against electrostatic discharge in normal handling. however, it is good practice to take normal precautions appropriate to handling mos devices. 11 thermal characteristics 12 quality specification in accordance with ?snw-fq-611-d? . 13 dc characteristics v ddd =v dda =2.0v; t amb =25 c; r l =5k ; all voltages with respect to ground (pins v ssa and v ssd ); unless otherwise specified. symbol parameter conditions min. max. unit v dd supply voltage note 1 ? 4.0 v t xtal(max) maximum crystal temperature ? 150 c t stg storage temperature ? 65 +125 c t amb ambient temperature ? 40 +85 c v es electrostatic handling voltage human body model ? 2000 +2000 v machine model ? 200 +200 v i sc(dac) short-circuit current of dac note 2 output short-circuited to v ssa ? 450 ma output short-circuited to v dda ? 300 ma symbol parameter conditions value unit r th(j-a) thermal resistance from junction to ambient in free air 145 k/w symbol parameter conditions min. typ. max. unit supplies v dda dac analog supply voltage note 1 1.8 2.0 3.6 v v ddd digital supply voltage note 1 1.8 2.0 3.6 v i dda dac analog supply current normal operating mode at 2.0 v supply voltage ? 2.3 ? ma at 3.0 v supply voltage ? 3.5 ? ma sleep mode at 2.0 v supply voltage ? 125 ? a at 3.0 v supply voltage ? 175 ? a
2002 may 22 12 nxp semico nductors product specification low power audio dac uda1334bt notes 1. all supply connections must be made to the same external power supply unit. 2. at 3 v supply voltage, the input pads are ttl compatible. however, at 2.0 v supply voltage no ttl levels can be accepted, but levels from 3.3 v domain can be applied to the pins. 3. when the dac drives a capacitive load above 50 pf, a series resistance of 100 must be used to prevent oscillations in the output operational amplifier. i ddd digital supply current normal operating mode at 2.0 v supply voltage ? 1.4 ? ma at 3.0 v supply voltage ? 2.1 ? ma sleep mode; at 2.0 v supply voltage clock running ? 250 ? a no clock running ? 20 ? a sleep mode; at 3.0 v supply voltage clock running ? 375 ? a no clock running ? 30 ? a digital input pins; note 2 v ih high-level input voltage at 2.0 v supply voltage 1.3 ? 3.3 v at 3.0 v supply voltage 2.0 ? 5.0 v v il low-level input voltage a t 2.0 v supply voltage ? 0.5 ? +0.5 v at 3.0 v supply voltage ? 0.5 ? +0.8 v ? i li ? input leakage current ?? 1 a c i input capacitance ?? 10 pf 3-level input: pin pcs v ih high-level input voltage 0.9v ddd ? v ddd +0.5 v v im mid-level input voltage 0.4v ddd ? 0.6v ddd v v il low-level input voltage ? 0.5 ? +0.5 v dac v ref(dac) reference voltage with respect to v ssa 0.45v dda 0.5v dda 0.55v dda v r o(ref) output resistance on pin v ref(dac) ? 25 ? k i o(max) maximum output curr ent (thd + n)/s < 0.1%; r l = 800 ? 1.6 ? ma r l load resistance 3 ?? k c l load capacitance note 3 ?? 50 pf symbol parameter conditions min. typ. max. unit
2002 may 22 13 nxp semico nductors product specification low power audio dac uda1334bt 14 ac characteristics 14.1 2.0 v supply voltage v ddd =v dda =2.0v; f i =1khz; t amb =25 c; r l =5k .; all voltages with re spect to ground (pins v ssa and v ssd ); unless otherwise specified. 14.2 3.0 v supply voltage v ddd =v dda =3.0v; f i =1khz; t amb =25 c; r l =5k ; all voltages with respect to ground (pins v ssa and v ssd ); unless otherwise specified. symbol parameter conditi ons min. typ. max. unit dac v o(rms) output voltage (rms value) at 0 db (fs) digital input ? 600 ? mv v o unbalance between channels ? 0.1 ? db (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s =44.1khz; at 0db ?? 80 ? db f s =44.1khz; at ? 60 db; a-weighted ?? 37 ? db f s =96khz; at 0db ?? 75 ? db f s =96khz; at ? 60 db; a-weighted ?? 35 ? db s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted ? 97 ? db f s = 96 khz; code = 0; a-weighted ? 95 ? db cs channel separation ? 100 ? db psrr power supply rejection ratio f ripple =1khz; v ripple =30mv(p-p) ? 60 ? db symbol parameter conditi ons min. typ. max. unit dac v o(rms) output voltage (rms value) at 0 db (fs) digital input ? 900 ? mv v o unbalance between channels ? 0.1 ? db (thd + n)/s total harmonic distortion-plus-noise to signal ratio f s =44.1khz; at 0db ?? 90 ? db f s =44.1khz; at ? 60 db; a-weighted ?? 40 ? db f s =96khz; at 0db ?? 85 ? db f s =96khz; at ? 60 db; a-weighted ?? 37 ? db s/n signal-to-noise ratio f s = 44.1 khz; code = 0; a-weighted ? 100 ? db f s = 96 khz; code = 0; a-weighted ? 98 ? db cs channel separation ? 100 ? db psrr power supply rejection ratio f ripple =1khz; v ripple =30mv(p-p) ? 60 ? db
2002 may 22 14 nxp semico nductors product specification low power audio dac uda1334bt 14.3 timing v ddd =v dda = 1.8 to 3.6 v; t amb = ? 20 to +85 c; r l =5k ; all voltages with re spect to ground (pins v ssa and v ssd ); unless otherwise specified; note 1. note 1. the typical value of the timing is specified at f s = 44.1 khz (sampling frequency). symbol parameter conditi ons min. typ. max. unit system clock timing (see fig.6) t sys system clock cycle time f sys = 256f s 35 88 780 ns f sys = 384f s 23 59 520 ns f sys = 512f s 17 44 390 ns t cwh system clock high time f sys < 19.2 mhz 0.3t sys ? 0.7t sys ns f sys 19.2 mhz 0.4t sys ? 0.6t sys ns t cwl system clock low time f sys < 19.2 mhz 0.3t sys ? 0.7t sys ns f sys 19.2 mhz 0.4t sys ? 0.6t sys ns reset timing t reset reset time 1 ?? s serial interface timing (see fig.7) f bck bit clock frequency ?? 64f s hz t bckh bit clock high time 50 ?? ns t bckl bit clock low time 50 ?? ns t r rise time ?? 20 ns t f fall time ?? 20 ns t su(datai) set-up time data input 20 ?? ns t h(datai) hold time data input 0 ?? ns t su(ws) set-up time word select 20 ?? ns t h(ws) hold time word select 10 ?? ns
2002 may 22 15 nxp semico nductors product specification low power audio dac uda1334bt handbook, full pagewidth mgr984 t sys t cwh t cwl fig.6 system clock timing. handbook, full pagewidth mgl880 t f t h(ws) t su(ws) t su(datai) t h(datai) t bckh t bckl t cy(bck) t r ws bck datai fig.7 serial interface timing.
2002 may 22 16 nxp semico nductors product specification low power audio dac uda1334bt 15 application information handbook, full pagewidth mgu677 47 r5 uda1334bt 6 sysclk system clock 1 bck 2 ws 3 datai 14 voutl r3 100 r1 220 k 16 voutr r4 100 r2 220 k 7 sfor1 11 sfor0 9 deem 10 pcs 8 mute 47 f (16 v) c4 47 f (16 v) c3 left output right output 12 v ref(dac) c7 47 f (16 v) c8 100 nf (63 v) 4 5 v ddd v ssd r6 1 digital supply voltage c6 15 13 v ssa v dda r7 1 c9 47 f (16 v) c10 100 nf (63 v) 100 nf (63 v) analog supply voltage c5 47 f (16 v) c1 10 nf (63 v) 10 nf (63 v) c2 fig.8 typical application diagram.
2002 may 22 17 nxp semico nductors product specification low power audio dac uda1334bt 16 package outline x w m a a 1 a 2 b p d h e l p q detail x e z e c l v m a (a ) 3 a 8 9 1 16 y pin 1 index unit a max. a 1 a 2 a 3 b p cd (1) e (1) (1) eh e ll p qz y w v references outline version european projection issue date iec jedec jeita mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 10.0 9.8 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 dimensions (inch dimensions are derived from the original mm dimensions) note 1. plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.0 0.4 sot109-1 99-12-27 03-02-19 076e07 ms-012 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.39 0.38 0.16 0.15 0.05 1.05 0.041 0.244 0.228 0.028 0.020 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 0 2.5 5 mm scale s o16: plastic small outline package; 16 leads; body width 3.9 mm sot109 -1
2002 may 22 18 nxp semico nductors product specification low power audio dac uda1334bt 17 soldering 17.1 introduction to soldering surface mount packages this text gives a very brief insight to a complex technology. a more in-depth account of soldering ics can be found in our ?data handbook ic26; integrated circuit packages? (document order number 9398 652 90011). there is no soldering method that is ideal for all surface mount ic packages. wave soldering ca n still be used for certain surface mount ics, but it is not suitable for fine pitch smds. in these situations reflow soldering is recommended. 17.2 reflow soldering reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. typical reflow peak temperatures range from 215to250 c. the top-surface temperature of the packages should preferable be kept below 220 c for thick/large packages, and below 235 c for small/thin packages. 17.3 wave soldering conventional single wave soldering is not recommended for surface mount devices (smds) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. to overcome these problems the double-wave soldering method was specif ically developed. if wave soldering is used the following conditions must be observed for optimal results: ? use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. ? for packages with leads on two sides and a pitch (e): ? larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; ? smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves at the downstream end. ? for packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. the footprint must incorporate solder thieves downstream and at the side corners. during placement and before soldering, the package must be fixed with a droplet of adhesive. the adhesive can be applied by screen printing, pin transfer or syringe dispensing. the package can be soldered after the adhesive is cured. typical dwell time is 4 seconds at 250 c. a mildly-activated flux will elim inate the need for removal of corrosive residues in most applications. 17.4 manual soldering fix the component by first soldering two diagonally-opposite end leads. use a low voltage (24 v or less) soldering iron applied to the flat part of the lead. contact time must be limit ed to 10 seconds at up to 300 c. when using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 c.
2002 may 22 19 nxp semico nductors product specification low power audio dac uda1334bt 17.5 suitability of surface m ount ic packages for wave and reflow soldering methods notes 1. for more detailed information on the bga packages refer to the ?(lf)bga application note ? (an01026); order a copy from your nxp semicond uctors sales office. 2. all surface mount (smd) packages are moisture sensitive. depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). for details, refer to the drypack information in the ?data handbook ic26; integrated circuit packages; section: packing methods? . 3. these packages are not suitable for wave soldering. on versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. on versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. if wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. the package footprint must incorporate solder thieves downstream and at the side corners. 5. wave soldering is suitable for lqfp, tqfp and qfp packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. wave soldering is suitable for ssop and tssop packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. package (1) soldering method wave reflow (2) bga, lbga, lfbga, sqfp, tfbga, vfbga not suitable suitable hbcc, hbga, hlqfp, hsqfp, hsop, htqfp, htssop, hvqfn, hvson, sms not suitable (3) suitable plcc (4) , so, soj suitable suitable lqfp, qfp, tqfp not recommended (4)(5) suitable ssop, tssop, vso not recommended (6) suitable
2002 may 22 20 nxp semico nductors product specification low power audio dac uda1334bt 18 data sheet status notes 1. please consult the most recently issued document before initiating or completing a design. 2. the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. the latest pr oduct status information is available on the internet at url http://www.nxp.com. document status (1) product status (2) definition objective data sheet development this document contains data from the objective specification for product development. preliminary data sheet qualification this document contains data from the preliminary specification. product data sheet production this document contains the product specification. 19 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semico nductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without lim itation - lost profits, lost savings, business interrup tion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semi conductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, lif e-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for incl usion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are fo r illustrative purposes only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assi stance with ap plications or customer product design. it is customer?s sole responsibility to dete rmine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as for the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applications and products using nxp semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect.
2002 may 22 21 nxp semico nductors product specification low power audio dac uda1334bt limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will c ause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeat ed exposure to lim iting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the general terms and conditions of comme rcial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconductors products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. quick reference data ? the quick refere nce data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not complete, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semiconductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without nxp semicond uctors? warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond nxp semiconductors? standard warranty and nxp semiconductors? product specifications.
nxp semiconductors provides high performance mixed signal and standard product solutions that leverage its leadi ng rf, analog, power management, interface, security and digital processing expertise contact information for additional information please visit: http://www.nxp.com for sales offices addresses send e-mail to: salesaddresses@nxp.com ? nxp b.v. 2010 all rights are reserved. reproduction in whole or in part is prohibited without the prior written consent of the copyright owne r. the information presented in this document does not form part of any quotation or contract, is believed to be accurate and reli able and may be changed without notice. no liabilit y will be accepted by the publisher for any consequen ce of its use. publicat ion thereof d oes not con vey nor imply any license under patent- or other industrial or intellectual property rights. customer notification this data sheet was changed to reflect the new company name nxp semiconductors, including new legal definitions and disclaimers. no changes were made to the technical content, except for package outline drawings which were updated to the latest version. printed in the netherlands 753503/01/pp 22 date of release: 2002 may 22 document order number: 9397 750 0974

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